Engineering Research Semianr Series 1, 2013: Rheology of Multi-Component Material used for Semiconductor Device

Dr Hideyuki Uematsu, University of Fukui, Japan,

Date: 2013-03-07
Time: 13:00 to 14:00
Venue: Engineering Meeting Room 1, 5-4-22


Polymeric materials have been used over a wide range such as in an electronics, life science field and so on.  High performance products have been supported with the advanced polymeric materials.  In order to control and improve the performance of materials, the polymeric materials are often blended with other polymer and filler such as ceramic and carbon nano-tube (CNT).  The materials are shaped into various forms by various processes.  Therefore, the processability and the productivity of multiple materials have to be controlled.  We focus on the development of advanced materials and the control of its processability in terms of rheology.  In this report, the rheological behavior of multi-component material used for semiconductor device is introduced.

In a semiconductor industry, IC chips are three-dimensionally integrated in order to increase the capacity of memory without a change of size.  The IC chips are stacked on a wafer using an adhesive film.  A film consists of three components; 1) epoxy resin (EP) to exert the adhesion strength and the heat resistance, 2) acrylic polymer (AP) having low Tg for elasticity and toughness at room temperature, 3) SiO2 particles to keep the linear expansion coefficient low.  It is possible to prevent the crack of adhesive film by adding AP.  Low expansion coefficient is achieved by adding high volume fraction of SiO2.  In the processing of stacking IC chip, it has been empirically found that the processability like a burr and void between IC chip.  So far it is very important to investigate the rheological behavior of AP/EP/SiO2 to improve the processability.  We report the rheological behavior of the adhesive film and processability of stacked film.

About the Speaker

Dr Hideyuki Uematsu has a PhD in Engineering from Yamagata University 2010. He joined University of Fukui since April 2010 and presently is an assistant professor in Fiber Amenity Engineering. After joining the University, he received two external grants and also received award for research in conference about fiber processing.  His research topic is on the control of flow behaviour of polymeric materials and application to processability.